| PART |
Description |
Maker |
| AN899 |
MCUS - SOLDERING RECOMMENDATIONS AND PACKAGING INFORMATION
|
SGS Thomson Microelectronics
|
| AN3232 |
Mounting recommendations
|
STMicroelectronics
|
| AN1235 |
package description and recommendations for use
|
STMicroelectronics
|
| TB502-3X-520-XX |
Test Board for chip evaluation and Layout recommendations
|
PLL[PhaseLink Corporation]
|
| AN1547 |
FLIP CHIP 170MICRONSM RECOMMENDATIONS FOR AUDIO POWER AMPLIFIERS
|
SGS Thomson Microelectronics
|
| KT11P4CM KT11P4SA1M KT11P4JM KT11B1SM KT11P2SM KT1 |
Internal actuator seal and insert molded terminals permit soldering and cleaning
Sealed Tactile Switches
Internal actuator seal and insert molded terminals?permit soldering and cleaning
|
C&K Components
|
| AN3025 |
Transistor Mounting and Soldering
|
M/A-COM Technology Solutions, Inc.
|
| AN10365 |
Surface mount reflow soldering
|
NXP Semiconductors
|
| VFHD1111CS-3B83A-TR |
Lead-free soldering compatible
|
STANLEY ELECTRIC CO.,LT...
|
| HZ1206D102R-10 |
LAND PATTERNS FOR REFLOW SOLDERING
|
List of Unclassifed Manufacturers
|
| AN4211 |
Guidelines for soldering MEMS microphones
|
STMicroelectronics
|
